LPS331AP

Application hints

Doc ID 022112 Rev 7

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Application hints

Figure 3.

LPS331AP electrical connection

The device core is supplied through the Vdd line. Power supply decoupling capacitors (100

nF ceramic, 10 µF aluminum) should be placed as near as possible to the supply pad of the

device (common design practice).

The functionality of the device and the measured data outputs are selectable and accessible

Vdd_IO).

4.1

Soldering information

soldering heat resistance according to JEDEC J-STD-020.

10µ

Vdd

100nF

GND

Vdd_IO

Res

Digital signal from/to signal controller. Signal levels are defined through proper selection of Vdd_

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