AD7392/AD7393

–4–

REV. A

PIN CONFIGURATIONS

14

13

12

11

17

16

15

20

19

18

10

9

8

1

2

3

4

7

6

5

TOP VIEW

(Not to Scale)

AD7392

AGND

DGND

D11

D10

D9

D8

D7

D6

SHDN

CS

RS

D0

D1

D2

D3

D4

D5

14

13

12

11

17

16

15

20

19

18

10

9

8

1

2

3

4

7

6

5

TOP VIEW

(Not to Scale)

AD7393

AGND

DGND

D9

D8

D7

D6

D5

D4

SHDN

CS

RS

NC

NC

D0

D1

D2

D3

NC = NO CONNECT

PIN DESCRIPTION

#

Name

Function

Positive Power Supply Input. Specified range

of operation +2.7 V to +5.5 V.

2

SHDN

Power Shutdown active low input. DAC regis-

ter contents are saved as long as power stays on

write new data into the DAC register.

3

CS

Chip Select latch enable, active low.

4

RS

Resets DAC register to zero condition. Asyn-

chronous active low input.

5, 6 NC

No connect Pins 5 and 6 on the AD7393.

17

DGND

Digital Ground.

18

AGND

Analog Ground.

19

DAC Voltage Output.

20

DAC Reference Input Pin. Establishes DAC

full-scale voltage.

D0–D11 12 parallel input data bits. D11 = MSB Pin 16,

D0 = LSB Pin 5, AD7392.

D0–D9

10 parallel input data bits. D9 = MSB. Pin 16,

D0 = LSB Pin 7, AD7393.

ORDERING GUIDE

Res

Package

Package

Model

(LSB)

Temp

Description

Option

AD7392AN

12

XIND

20-Lead P-DIP

N-20

AD7392AR

12

XIND

20-Lead SOIC

R-20

AD7393AN

10

XIND

20-Lead P-DIP

N-20

AD7393AR

10

AUTO

20-Lead SOIC

R-20

AD7393ARU 10

XIND

TSSOP-20

RU-20

NOTES

XIND = –40

°C to +85°C; AUTO = –40°C to +125°C.

The AD7392 contains 709 transistors. The die size measures 78 mil

× 85 mil =

6630 sq. mil.

ABSOLUTE MAXIMUM RATINGS*

Logic Inputs to GND . . . . . . . . . . . . . . . . . . . . . –0.3 V, +8 V

DGND to AGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +2 V

θ

JA

Thermal Resistance

θ

JA

20-Lead Plastic DIP Package (N-20) . . . . . . . . . . . 57

°C/W

20-Lead SOIC Package (R-20) . . . . . . . . . . . . . . . . 60

°C/W

20-Lead Thin-Shrink Surface Mount (RU-20) . . . 155

°C/W

°C

Operating Temperature Range . . . . . . . . . . . –40

°C to +85°C

AD7393AR . . . . . . . . . . . . . . . . . . . . . . . . . –40

°C to +125°C

Storage Temperature Range . . . . . . . . . . . . –65

°C to +150°C

Lead Temperature

N-20 (Soldering, 10 sec) . . . . . . . . . . . . . . . . . . . . . +300

°C

R-20 (Vapor Phase, 60 sec) . . . . . . . . . . . . . . . . . . .+215

°C

RU-20 (Infrared, 15 sec) . . . . . . . . . . . . . . . . . . . . . +220

°C

*Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those indicated in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the AD7392/AD7393 feature proprietary ESD protection circuitry, permanent damage

may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

CS

DB11–DB0

RS

DATA VALID

1

0

0

0

1

1

FS

ZS

0.1% FS

ERROR BAND

Figure 3. Timing Diagram

CS

RS

TO

INTERNAL

DAC

SWITCHES

1 OF 12 LATCHES

OF THE

DAC REGISTER

Figure 4. Digital Control Logic

WARNING!

ESD SENSITIVE DEVICE