ADEL2020

REV. A

–11–

OUTLINE DIMENSIONS

Dimensions shown in inches and (mm).

Plastic Mini-DIP (N) Package

0.011 ±0.003

(0.28 ±0.08)

0.30 (7.62)

REF

15

°

0

°

PIN 1

4

5

8

1

0.25

(6.35)

0.31

(7.87)

0.10

(2.54)

BSC

SEATING

PLANE

0.035 ±0.01

(0.89 ±0.25)

0.18 ±0.03

(4.57 ±0.76)

0.033

(0.84)

NOM

0.018 ±0.003

(0.46 ±0.08)

0.125

(3.18)

MIN

0.165 ±0.01

(4.19 ±0.25)

0.39 (9.91) MAX

20-Lead Wide Body SOIC (R) Package

PIN 1

0.300 (7.60)

0.292 (7.40)

11

10

1

20

0.419 (10.65)

0.394 (10.00)

0.010

(0.254)

0.050 (1.27)

0.016 (0.40)

0.020 (0.51) x 45

°

CHAMF

8

°

0

°

0.512 (13.00)

0.496 (12.60)

0.104 (2.64)

0.093 (2.36)

0.011 (0.28)

0.004 (0.10)

0.019 (0.48)

0.014 (0.36)

0.050 (1.27)

BSC

0.450 (11.43)

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