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MS336RAA030JSZ データシート(PDF) 2 Page - Coilcraft lnc.

部品番号 MS336RAA030JSZ
部品情報  High-Reliability Chip Inductors
PDF  2 Pages
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メーカー  COILCRAFT [Coilcraft lnc.]
ホームページ  http://www.coilcraft.com
Logo COILCRAFT - Coilcraft lnc.

MS336RAA030JSZ データシート(HTML) 2 Page - Coilcraft lnc.

  MS336RAA030JSZ Datasheet HTML 1Page - Coilcraft lnc. MS336RAA030JSZ Datasheet HTML 2Page - Coilcraft lnc.  
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MS336RAASeries(0805)
®
© Coilcraft, Inc. 2012
1102 Silver Lake Road
Cary, IL 60013
Phone 800-981-0363
Fax 847-639-1508
Email cps@coilcraft.com
www.coilcraft-cps.com
This product may not be used in medical or high
risk applications without prior Coilcraft approval.
Specifications subject to change without notice.
Please check our web site for latest information.
Document MS100-2 Revised 11/06/12
0805 CHIP INDUCTORS
Typical Q vs Frequency
Typical L vs Frequency
A max B max C max D ref
E
F
G
H
I
J
0.090 0.068 0.060 0.020 0.050 0.020 0.040 0.070 0.040 0.030
2,29
1,73
1,52
0,51
1,27
0,51
1,02
1,78
1,02
0,76
1
10
100
1000
10
100
1000
Frequency (MHz)
220 nH
100 nH
39 nH
15 nH
3.3 nH
12 nH
6.8 nH
3.3 nH
22 nH
39 nH
68 nH
120 nH
270 nH
10
100
Frequency (MHz)
1000
10,000
100
90
80
70
60
50
40
30
20
10
0
-40 -20
020406080
100
160
140
120
Ambient temperature (°C)
120
110
100
90
80
70
60
50
40
30
20
10
0
Current Derating
Core material Ceramic
Terminations Tin-lead (63/37) over silver-platinum-glass frit
Ambient temperature –55°C to +125°C with Imax current, +125°C
to +155°C with derated current
Storage temperature Component: –55°C to +155°C.
Packaging: –55°C to +80°C
Resistance to soldering heat Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Temperature Coefficient of Inductance (TCL) +25 to +155 ppm/°C
Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C /
85% relative humidity)
Enhanced crush-resistant packaging 2000 per 7
″ reel
Plastic tape: 8 mm wide, 0.23 mm thick, 4 mm pocket spacing,
1.65 mm pocket depth
J
H
A
B
overall
F
G
E
terminal
F
C
D
Terminal wraparound:
approx 0.015/0,38 both ends
I
I
Suggested
Land Pattern
Note: Dimensions are before solder application. For maximum over-
all dimensions including solder, add 0.0025 in / 0,064 mm to
B
and 0.006 in / 0,15 mm to
A and C.



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