OPA313

OPA2313

OPA4313

www.ti.com

SBOS649C – SEPTEMBER 2012 – REVISED MARCH 2013

THERMAL INFORMATION: OPA313

OPA313

DBV (SOT23)

DCK (SC70)

UNITS

5 PINS

5 PINS

Junction-to-ambient thermal resistance

228.5

281.4

Junction-to-case(top) thermal resistance

99.1

91.6

Junction-to-board thermal resistance

54.6

59.6

°C/W

Junction-to-top characterization parameter

7.7

1.5

Junction-to-board characterization parameter

53.8

58.8

Junction-to-case(bottom) thermal resistance

N/A

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

THERMAL INFORMATION: OPA2313

OPA2313

D (SO)

DGK (MSOP)

DRG (DFN)

UNITS

8 PINS

8 PINS

8 PINS

Junction-to-ambient thermal resistance

138.4

191.2

53.8

Junction-to-case(top) thermal resistance

89.5

61.9

69.2

Junction-to-board thermal resistance

78.6

111.9

20.1

°C/W

Junction-to-top characterization parameter

29.9

5.1

3.8

Junction-to-board characterization parameter

78.1

110.2

20.0

Junction-to-case(bottom) thermal resistance

N/A

N/A

11.6

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

THERMAL INFORMATION: OPA4313

OPA4313

PW (TSSOP)

UNITS

14 PINS

Junction-to-ambient thermal resistance

121.0

Junction-to-case(top) thermal resistance

49.4

Junction-to-board thermal resistance

62.8

°C/W

Junction-to-top characterization parameter

5.9

Junction-to-board characterization parameter

62.2

Junction-to-case(bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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