SW06

REV. A

–4–

WAFER TEST LIMITS

SW06N

SW06G

Parameter

Symbol

Conditions

Limit

Limit

Units

“ON” RESISTANCE

–10 V

≤ V

80

100

Ω max

≤ 100 µA

15

20

% max

∆R

∆R

ON

–10 V

≤ V

A

≤ 10 V, I

S

≤ 1 mA

10

20

% max

POSITIVE SUPPLY CURRENT

I+

Note 1

6.0

9.0

mA max

NEGATIVE SUPPLY CURRENT

I–

Note 1

5.0

7.0

mA max

GROUND CURRENT

Note 1

4.0

4.0

mA max

ANALOG VOLTAGE RANGE

±10.0

±10.0

V min

LOGIC “1” INPUT VOLTAGE

Note 2

2.0

2.0

V min

LOGIC “0” INPUT VOLTAGE

Note 2

0.8

0.8

V max

LOGIC “0” INPUT CURRENT

0 V

≤ V

IN

≤ 0.8 V

5.0

5.0

µA max

LOGIC “1” INPUT CURRENT

2.0 V

≤ V

IN

55

µA max

ANALOG CURRENT RANGE

10

7

mA min

NOTE

Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed

for standard product dice. Consult factory to negotiate specifications based on dice lot qualification through sample lot assembly and testing.

TYPICAL ELECTRICAL CHARACTERISTICS

SW06N

SW06G

Parameter

Symbol

Conditions

Typical

Typical

Units

“ON” RESISTANCE

–10 V

≤ V

A

≤ 10 V, I

S

≤ 1 mA

60

60

Ω

TURN-ON TIME

340

340

ns

TURN-OFF TIME

200

200

ns

DRAIN CURRENT IN

“OFF” CONDITION

0.3

0.3

nA

“OFF” ISOLATION

58

58

dB

CROSSTALK

Ω

70

70

dB

NOTES