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D371 データシート(PDF) 2 Page - Agere Systems |
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D371 データシート(HTML) 2 Page - Agere Systems |
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2 / 8 page ![]() Data Sheet D371-Type Digital Uncooled DFB Laser Module January 1999 2 2 Agere Systems Inc. Description (continued) The device characteristics listed in this document are met at 2.0 mW output power. Higher- or lower-power operation is possible. Under conditions of a fixed pho- todiode current, the change in optical output is typically ±0.5 dB over an operating temperature range of –40 °C to +85 °C. This device incorporates the new Laser 2000 manufac- turing process developed by the Optoelectronic unit of Agere Systems Inc. Laser 2000 is a low-cost platform that targets high-volume manufacturing and tighter product distributions on all optical subassemblies. The platform incorporates an advanced optical design that is produced on a highly automated production line. The Laser 2000 platform is qualified for the central office and uncontrolled environments, and can be used for applications requiring high performance and low cost. Table 1. Pin Descriptions Pin Number Connection 1 NC/reserved 2 Case ground 3 NC/reserved 4 Photodiode cathode 5 Photodiode anode 6 Laser diode cathode 7 Laser diode anode 8 NC/reserved Figure 1. D371-Type Digital Uncooled DFB Laser Module Schematic, Top View Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso- lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect device reliability. * Rating varies with temperature. Parameter Symbol Min Max Unit Maximum Peak Laser Drive Current or Maximum Fiber Power* IOP PMAX — — 150 10 mA mW Peak Reverse Laser Voltage: Laser Monitor VRL VRD — — 2 20 V V Monitor Forward Current IFD —2 mA Operating Case Temperature Range TC –40 85 °C Storage Case Temperature Range Tstg –40 85 °C Lead Soldering Temperature/Time — — 260/10 °C/s Relative Humidity (noncondensing) RH — 85 % 1-900 (C) 56 8 7 43 1 2 |
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