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BTA24 データシート(PDF) 5 Page - STMicroelectronics

部品番号 BTA24
部品情報  25 A standard and Snubberless™ triacs
PDF  12 Pages
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メーカー  STMICROELECTRONICS [STMicroelectronics]
ホームページ  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

BTA24 データシート(HTML) 5 Page - STMicroelectronics

  BTA24 Datasheet HTML 1Page - STMicroelectronics BTA24 Datasheet HTML 2Page - STMicroelectronics BTA24 Datasheet HTML 3Page - STMicroelectronics BTA24 Datasheet HTML 4Page - STMicroelectronics BTA24 Datasheet HTML 5Page - STMicroelectronics BTA24 Datasheet HTML 6Page - STMicroelectronics BTA24 Datasheet HTML 7Page - STMicroelectronics BTA24 Datasheet HTML 8Page - STMicroelectronics BTA24 Datasheet HTML 9Page - STMicroelectronics Next Button
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BTA24, BTB24, BTA25, BTA26, BTB26, T25
Characteristics
5/12
Figure 7.
Non-repetitive surge peak on-state
current for a sinusoidal pulse with
width tp < 10 ms and corresponding
value of I2t
Figure 8.
Relative variation of gate trigger
current, holding current and
latching current versus junction
temperature (typical values)
0.01
0.10
1.00
10.00
100
1000
3000
I
(A), I t (A s)
TSM
22
t (ms)
p
T initial=25°C
j
ITSM
dI/dt limitation:
50A/µs
I t
2
-40
-20
0
20
40
60
80
100
120
140
0.0
0.5
1.0
1.5
2.0
2.5
T (°C)
j
I,I ,I [T ] /
GT H L
j
I
,I ,I [T =25°C]
GT H L
j
IGT
IH & IL
Figure 9.
Relative variation of critical rate of
decrease of main current versus
(dV/dt)c (typical values)
Figure 10.
Relative variation of critical rate of
decrease of main current versus Tj
Figure 11.
D2PAK thermal resistance junction to
ambient versus copper surface under
tab (printed circuit board FR4, copper
thickness: 35 µm)
0.1
1.0
10.0
100.0
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
(dV/dt)c (V/µs)
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
T2535/CW/BW
B
0
25
50
75
100
125
0
1
2
3
4
5
6
(dI/dt)c [T ] /
pecified]
j
(dI/dt)c [T s
j
T (°C)
j
0
4
8
12
16
20
24
28
32
36
40
0
10
20
30
40
50
60
70
80
S(cm²)
R
(°C/W)
th(j-a)
DPAK
2



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