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PRAHT182 データシート(PDF) 3 Page - Vishay Siliconix |
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PRAHT182 データシート(HTML) 3 Page - Vishay Siliconix |
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3 / 4 page ![]() PRAHT 100, PRAHT 135, PRAHT 182 (CNW) www.vishay.com Vishay Sfernice Revision: 20-Nov-12 3 Document Number: 53057 For technical questions, contact: sferthinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PACKAGING RULES Waffle Pack Can be filled up to maximum quantity indicated in the table here above, taking into account the minimum order quantity. When quantity ordered exceeds maximum quantity of a single waffle pack, the waffle packs are stacked up on the top of each other and closed by one single cover. To get “not stacked up” waffle pack in case of ordered quantity > maximum number of pieces per package: Please consult Vishay Sfernice for specific ordering code. Tape and Reel Can be filled up to maximum quantity indicated in the table here above, taking into account the minimum order quantity. When quantity ordered is between the MOQ and the maximum reel capacity, only one reel is provided. When several reels are needed for ordered quantity within MOQ and maximum reel capacity: Please consult Vishay Sfernice for specific ordering code. MARKING On the primary package, printed information includes Vishay S.A. trademark series and model, schematic number of resistors, ohmic value, absolute tolerance, ratio tolerance, type of termination: B tinned over nickel barrier. Marking on parts: E.g.: Ohmic value 13K: Coded 1302: M = 1, C = 3, D = 0, U = 2 Note • Rn: Nominal resistance 12 87 R1 R2 M 34 65 R3 R4 CD U PERFORMANCE TESTS CONDITIONS CECC REQUIREMENTS DRIFTS ABSOLUTE PER (Typical Values) RATIO Overload 2.5 Un/2 s 0.05 % Rn + 0.05 0.01 % Rn Climatic sequences - 55 °C + 155 °C/5 moisture cycles 0.1 % Rn + 0.05 0.01 % Rn Thermal shock - 55 °C + 155 °C/5 cycles 30' 0.05 % Rn + 0.05 0.01 % Rn Load life 1000 h/Pn at 215 °C 0.5 % Rn 0.25 % Rn 8000 h/Pn at 215 °C 0.7 % Rn 0.4 % Rn Resistance to solder heat 260 °C/10 s 0.05 % Rn + 0.05 0.01 % Rn Moisture resistance 0.01 Pn at + 40 °C 93 % RH 0.1 % Rn + 0.05 0.01 % Rn High temperature storage 1000 h/no load at + 155 °C 0.1 % Rn + 0.05 0.02 % Rn |
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