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STP3NK90Z データシート(PDF) 5 Page - STMicroelectronics |
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STP3NK90Z データシート(HTML) 5 Page - STMicroelectronics |
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5 / 20 page ![]() STD3NK90Z, STP3NK90Z, STP3NK90ZFP Electrical characteristics Doc ID 9193 Rev 2 5/20 The built-in back-to-back Zener diodes have been specifically designed to enhance not only the device’s ESD capability, but also to make them capable of safely absorbing any voltage transients that may occasionally be applied from gate to source. In this respect, the Zener voltage is appropriate to achieve efficient and cost-effective protection of device integrity. The integrated Zener diodes thus eliminate the need for external components. Table 8. Source drain diode Symbol Parameter Test conditions Min. Typ. Max. Unit ISD ISDM (1) 1. Pulse width limited by safe operating area Source-drain current Source-drain current (pulsed) - 3 12 A A VSD (2) 2. Pulsed: pulse duration = 300µs, duty cycle 1.5% Forward on voltage ISD = 3 A, VGS = 0 - 1.6 V trr Qrr IRRM Reverse recovery time Reverse recovery charge Reverse recovery current ISD= 3 A, di/dt = 100A/µs, VDD=40 V, Tj=150°C (Figure 22) - 510 2.2 8.7 ns µC A Table 9. Gate-source zener diode Symbol Parameter Test conditions Min. Typ. Max. Unit V(BR)GSO Gate-source breakdown voltage IGS=± 1 mA, ID=0 30 - - V |
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