MCP1651ST-ESLASHMS datasheet(21/30 Pages) MICROCHIP

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DS21876B-page 21

MCP1650/51/52/53

Figure 6-2 represents the top wiring for the MCP1650/

51/52/53 application shown.

As shown in Figure 6-2, the high-current wiring is short

and wide. In this example, a 1 oz. copper layer is used

for both the top and bottom layers. The ground plane

connected to C2 and R4 are connected through the

vias (holes) connecting the top and bottom layer. The

feedback signal (from TP2) is wired from the output of

the regulator around the high current switching section

to the feedback voltage divider and to the FB pin of the

MCP1650/51/52/53.

FIGURE 6-2:

Top Layer Wiring.

Figure 6-3 represents the bottom wiring for the

MCP1650/51/52/53 application shown.

Silk-screen reference designator labels are transparent

from the top of the board. The analog ground plane and

power ground plane are connected near the ground

connection of the input capacitor (C2). This prevents

high-power, ground-circulating currents from flowing

through the analog ground plane.

FIGURE 6-3:

Bottom Layer Wiring.

MCP1651ST-E/MS データシート(PDF) 21 Page - Microchip Technology