GD82541PI datasheet(35/46 Pages) INTEL

35 / 46 page

Networking Silicon — 82541(PI/GI/EI)

5.2

Thermal Specifications

The 82541(PI/GI/EI) device is specified for operation when the ambient temperature (TA) is within

the range of 0° C to 70° C.

TC (case temperature) is calculated using the equation:

TC = TA + P (θJA - θJC)

TJ (junction temperature) is calculated using the equation:

TJ = TA + P θJA

P (power consumption) is calculated by using the typical ICC, as indicated in Table 7 of Section 4.0,

and nominal VCC. The preliminary thermal resistances are shown in Table 13.

Thermal resistances are determined empirically with test devices mounted on standard thermal test

boards. Real system designs may have different characteristics due to board thickness, arrangement

of ground planes, and proximity of other components. The case temperature measurements should

be used to assure that the 82541(PI/GI/EI) device is operating under recommended conditions.

Table 13. Thermal Characteristics

Symbol

Parameter

Preliminary Value at specified

airflow (m/s)

Units

012

θJA

Thermal resistance, junction-to-ambient

25.0

23.5

C/Watt

θJC

Thermal resistance, junction-to-case

11.1

C/Watt

GD82541PI データシート(PDF) 35 Page - Intel Corporation