MPC8358ECVRADDDA datasheet(13/102 Pages) FREESCALE

13 / 102 page

MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5

Freescale Semiconductor

Power Sequencing

667

333

500

6.1

6.8

2, 3, 5, 9

Notes:

1. The values do not include I/O supply power (OVDD, LVDD, GVDD) or AVDD. For I/O power values, see Table 6.

2. Typical power is based on a voltage of VDD = 1.2 V or 1.3 V, a junction temperature of TJ = 105° C, and a Dhrystone

benchmark application.

3. Thermal solutions need to design to a value higher than typical power on the end application, TA target, and I/O power.

4. Maximum power is based on a voltage of VDD = 1.2 V, WC process, a junction TJ = 105° C, and an artificial smoke test.

5. Maximum power is based on a voltage of VDD = 1.3 V for applications that use 667 MHz (CPU)/500 (QE) with WC process,

a junction TJ = 105° C, and an artificial smoke test.

6. Typical power is based on a voltage of VDD = 1.3 V, a junction temperature of TJ = 70° C, and a Dhrystone benchmark

application.

7. Maximum power is based on a voltage of VDD = 1.3 V for applications that use 667 MHz (CPU) or 500 (QE) with WC

process, a junction TJ = 70° C, and an artificial smoke test.

8. This frequency combination is only available for rev. 2.0 silicon.

9. This frequency combination is not available for rev. 2.0 silicon.

Table 5. MPC8358E TBGA Core Power Dissipation1

Core

Frequency (MHz)

CSB

Frequency (MHz)

QUICC Engine

Frequency (MHz)

Typical

Maximum

Unit

Notes

266

300

4.1

4.5

2, 3, 4

400

266

400

4.5

5.0

2, 3, 4

Notes:

1. The values do not include I/O supply power (OVDD, LVDD, GVDD) or AVDD. For I/O power values, see Table 6.

2. Typical power is based on a voltage of VDD = 1.2 V, a junction temperature of TJ = 105° C, and a Dhrystone benchmark

application.

3. Thermal solutions need to design to a value higher than typical power on the end application, TA target, and I/O power.

4. Maximum power is based on a voltage of VDD = 1.2 V, WC process, a junction TJ = 105° C, and an artificial smoke test.

Table 4. MPC8360E TBGA Core Power Dissipation1 (continued)

Core

Frequency (MHz)

CSB

Frequency (MHz)

QUICC Engine

Frequency (MHz)

Typical

Maximum

Unit

Notes

MPC8358ECVRADDDA データシート(PDF) 13 Page - Freescale Semiconductor, Inc

MPC8358ECVRADDDA データシート(HTML) 13 Page - Freescale Semiconductor, Inc

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

データシートダウンロード

リンク URL

MPC8358ECVRADDDA データシート(PDF) 13 Page - Freescale Semiconductor, Inc

MPC8358ECVRADDDA データシート(HTML) 13 Page - Freescale Semiconductor, Inc

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

データシート ダウンロード

リンク URL

データシートダウンロード