 2010 Microchip Technology Inc.

DS21203Q-page 31

24AA256/24LC256/24FC256

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO.

X

/XX

Package

Temperature

Range

Device

Device:

24AA256:

EEPROM

EEPROM Tape and Reel)

24LC256:

EEPROM

24LC256T:

EEPROM Tape and Reel)

24FC256:

EEPROM

EEPROM Tape and Reel)

Temperature

Range:

I=

-40

C to +85C

E=

-40

C to +125C

Package:

P

= Plastic DIP (300 mil body), 8-lead

SN

= Plastic SOIC (3.90 mm body), 8-lead

SM = Plastic SOIJ (5.28 mm body), 8-lead

ST

= Plastic TSSOP (4.4 mm), 8-lead

MF

= Dual, Flat, No Lead (DFN)(6x5 mm

body), 8-lead

MS = Plastic Micro Small Outline (MSOP),

8-lead

Examples:

a)

24AA256-I/P:

Industrial Temp.,

1.7V, PDIP package.

b)

24AA256T-I/SN: Tape and Reel,

Industrial Temp., 1.7V, SOIC

package.

c)

24AA256-I/ST:

Industrial Temp.,

1.7V, TSSOP package.

d)

24AA256-I/MS:

Industrial Temp.,

1.7V, MSOP package.

e)

24LC256-E/P:

Extended Temp.,

2.5V, PDIP package.

f)

24LC256-I/SN:

Industrial Temp.,

2.5V, SOIC package.

g)

24LC256T-I/SN: Tape and Reel,

Industrial Temp., 2.5V, SOIC

package.

h)

24LC256-I/MS:

Industrial Temp,

2.5V, MSOP package.

i)

24FC256-I/P:

Industrial Temp,

1.7V, High Speed, PDIP package.

j)

24FC256-I/SN:

Industrial Temp,

1.7V, High Speed, SOIC package.

k)

24FC256T-I/SN: Tape and Reel,

Industrial Temp, 1.7V, High Speed,

SOIC package