2SA2039 / 2SC5706

No.6912-2/10

Continued from preceding page.

Parameter

Symbol

Conditions

Ratings

Unit

Base Current

IB

(--)1.2

A

Collector Dissipation

PC

0.8

W

Tc=25°C15

W

Junction Temperature

Tj

150

°C

Storage Temperature

Tstg

--55 to +150

°C

Electrical Characteristics at Ta=25°C

Parameter

Symbol

Conditions

Ratings

Unit

min

typ

max

Collector Cutoff Current

ICBO

VCB=(--)40V, IE=0A

(--)1

μA

Emitter Cutoff Current

IEBO

VEB=(--)4V, IC=0A

(--)1

μA

DC Current Gain

hFE

VCE=(--)2V, IC=(--)500mA

200

560

Gain-Bandwidth Product

fT

VCE=(--)10V, IC=(--)500mA

(360)400

MHz

Output Capacitance

Cob

VCB=(--)10V, f=1MHz

(24)15

pF

Collector-to-Emitter Saturation Voltage

VCE(sat)1

IC=(--)1A, IB=(--)50mA

(--115)90

(--195)135

mV

VCE(sat)2

IC=(--)2A, IB=(--)100mA

(--255)160

(--430)240

mV

Base-to-Emitter Saturation Voltage

VBE(sat)

VCE=(--)2V, IB=(--)100mA

(--)0.89

(--)1.2

V

Collector-to-Base Breakdown Voltage

V(BR)CBO

IC=(--)10μA, IE=0A

(--50)100

V

Collector-to-Emitter Breakdown Voltage

V(BR)CES

IC=(--)100μA, RBE=0Ω

(--50)100

V

Collector-to-Emitter Breakdown Voltage

V(BR)CEO

IC=(--)1mA, RBE=∞

(--)50

V

Emitter-to-Base Breakdown Voltage

V(BR)EBO

IE=(--)10μA, IC=0A

(--)6

V

Turn-On Time

ton

See specified Test Circuit.

(30)35

ns

Storage Time

tstg

(230)300

ns

Fall Time

tf

(15)20

ns

Switching Time Test Circuit

Ordering Information

Device

Package

Shipping

memo

2SA2039-E

TP

500pcs./bag

Pb Free

2SC5706-E

TP

500pcs./bag

2SC5706-H

TP

500pcs./bag

Pb Free & Halogen Free

2SA2039-TL-E

TP-FA

700pcs./reel

Pb Free

2SC5706-TL-E

TP-FA

700pcs./reel

2SC5706-TL-H

TP-FA

700pcs./reel

Pb Free & Halogen Free

VR10

25Ω

VCC=25V

VBE= --5V

IC=10IB1= --10IB2=1A

+

+

50Ω

INPUT

OUTPUT

RB

100μF

470μF

PW=20μs

IB1

IB2

D.C.≤1%

For PNP, the polarity is reversed.

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating

Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.