MCP6044T-ESLASHST datasheet(17/40 Pages) MICROCHIP

17 / 40 page

 2001-2013 Microchip Technology Inc.

DS21669D-page 17

MCP6041/2/3/4

6.0

PACKAGING INFORMATION

6.1

Package Marking Information

8-Lead MSOP

Example

XXXXXX

YWWNNN

6043I

304256

5-Lead SOT-23 (

MCP6041)

Example:

XXNN

7X25

Device

I-Temp

Code

E-Temp

Code

MCP6041/T-E/OT

SPNN

7XNN

Note:

Parts

with

date

codes

prior

November 2012 have their package

markings in the SBNN format.

6-Lead SOT-23 (

MCP6043)

Example:

XXNN

SC25

Legend: XX...X

Customer-specific information

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

NNN

Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

This package is Pb-free. The Pb-free JEDEC designator (

)

can be found on the outer packaging for this package.

Note:

In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

Device

I-Temp

Code

E-Temp

Code

MCP6043T-E/CH

SCNN

SDNN

XXXXXXXX

XXXXXNNN

YYWW

8-Lead PDIP (300 mil)

Example

8-Lead SOIC (150 mil)

Example

XXXXXXXX

XXXXYYWW

NNN

MCP6041

I/P256

1304

MCP6042

I/SN1304

256

MCP6041

I/P

256

1304

MCP6042I

1304

256

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