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LT1370HV データシート(PDF) 15 Page - Linear Technology |
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LT1370HV データシート(HTML) 15 Page - Linear Technology |
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15 / 16 page ![]() 15 LT1072 1072fc Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen- tation that the interconnection of its circuits as described herein will not infringe on existing patent rights. SW Package 16-Lead Plastic Small Outline (Wide .300 Inch) (Reference LTC DWG # 05-08-1620) S8 Package 8-Lead Plastic Small Outline (Narrow .150 Inch) (Reference LTC DWG # 05-08-1610) PACKAGE DESCRIPTIO .016 – .050 (0.406 – 1.270) .010 – .020 (0.254 – 0.508) × 45° 0°– 8° TYP .008 – .010 (0.203 – 0.254) SO8 0502 .053 – .069 (1.346 – 1.752) .014 – .019 (0.355 – 0.483) TYP .004 – .010 (0.101 – 0.254) .050 (1.270) BSC 1 N 2 3 4 N/2 .150 – .157 (3.810 – 3.988) NOTE 3 8 7 6 5 .189 – .197 (4.801 – 5.004) NOTE 3 .228 – .244 (5.791 – 6.197) .245 MIN N 12 3 N/2 .160 ±.005 RECOMMENDED SOLDER PAD LAYOUT .045 ±.005 .050 BSC .030 ±.005 TYP INCHES (MILLIMETERS) NOTE: 1. DIMENSIONS IN 2. DRAWING NOT TO SCALE 3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm) S16 (WIDE) 0502 NOTE 3 .398 – .413 (10.109 – 10.490) NOTE 4 16 15 14 13 12 11 10 9 1 N 23 4 5 6 78 N/2 .394 – .419 (10.007 – 10.643) .037 – .045 (0.940 – 1.143) .004 – .012 (0.102 – 0.305) .093 – .104 (2.362 – 2.642) .050 (1.270) BSC .014 – .019 (0.356 – 0.482) TYP 0° – 8° TYP NOTE 3 .009 – .013 (0.229 – 0.330) .005 (0.127) RAD MIN .016 – .050 (0.406 – 1.270) .291 – .299 (7.391 – 7.595) NOTE 4 × 45° .010 – .029 (0.254 – 0.737) INCHES (MILLIMETERS) NOTE: 1. DIMENSIONS IN 2. DRAWING NOT TO SCALE 3. PIN 1 IDENT, NOTCH ON TOP AND CAVITIES ON THE BOTTOM OF PACKAGES ARE THE MANUFACTURING OPTIONS. THE PART MAY BE SUPPLIED WITH OR WITHOUT ANY OF THE OPTIONS 4. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm) .420 MIN .325 ±.005 RECOMMENDED SOLDER PAD LAYOUT .045 ±.005 N 12 3 N/2 .050 BSC .030 ±.005 TYP |
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