| データシートサーチシステム |
|
LT6555IGN データシート(PDF) 9 Page - Linear Technology |
|
|
|||||||||||||||||||||||||||||
LT6555IGN データシート(HTML) 9 Page - Linear Technology |
|
9 / 16 page ![]() LT6555 9 6555f APPLICATIO S I FOR ATIO VREF voltage to the desired level. The only way to cover the full common mode voltage range of V– + 1V to V+ – 1V is to shift VREF up or down. Note that on a single supply, the unclamped input range limits the output low swing to 2V (1V multiplied by the internal gain of 2). The VREF pin can also be directly driven with a DC source. Bypassing the VREF pin is not necessary. The inputs can be driven beyond the point at which the output clips so long as input currents are limited to less than ±10mA. Continuing to drive the input beyond the output limit can result in increased current drive and slightly increased swing, but will also increase supply current and may result in delays in transient response at larger levels of overdrive. Layout and Grounding It is imperative that care is taken in PCB layout in order to benefit from the very high speed and very low crosstalk of the LT6555. Separate power and ground planes are highly recommended and trace lengths should be kept as short as possible. If input or output traces must be run over a distance of several centimeters, they should use a con- trolled impedance with matching series and shunt resis- tances (nominally 75 Ω) to maintain signal fidelity. Series termination resistors should be placed as close to the output pins as possible to minimize output capaci- tance. See the Typical Performance Characteristics sec- tion for a plot of frequency response with various output capacitors—only 10pF of parasitic output capacitance before the series termination resistor causes 6dB of peaking in the frequency response! Low ESL/ESR bypass capacitors should be placed as close to the positive and negative supply pins as possible. One 4700pF ceramic capacitor is recommended for both V+ and V– supply busses. Additional 470pF ceramic ca- pacitors with minimal trace length on each supply pin will further improve AC and transient response as well as channel isolation. For high current drive and large-signal transient applications, additional 1 µF to 10µF tantalums should be added on each supply. The smallest value capacitors should be placed closest to the package. If the AGND pins are not connected to ground, they must be carefully bypassed to maintain minimal impedance over frequency. Although crosstalk will vary depending upon board layout, a recommended starting point for bypass capacitors would be 470pF as close as possible to each AGND pin with a single 4700pF capacitor in parallel. VREF 40k 40k 6555 F01 V+ V– IN Figure 1. Simplified Schematic of VREF Pin and Input Clamping |
|
|
リンク URL |
| ALLDATASHEETはお客様のビジネスに役立ちますか? [ DONATE ] |
Alldatasheetは | 広告 | お問い合わせ | プライバシーポリシー | データシートへのリンク | リンク交換 | メーカーリスト All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |