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RC2012 データシート(PDF) 28 Page - Samsung semiconductor

部品番号 RC2012
部品情報  THICK-FILM CHIP RESISTOR
PDF  40 Pages
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メーカー  SAMSUNG [Samsung semiconductor]
ホームページ  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

RC2012 データシート(HTML) 28 Page - Samsung semiconductor

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Arrays(Flat Type)
RF062P
RF064P
Type
0.80±0.05
1.40±0.05
0.60±0.05
0.60±0.05
0.23±0.10
0.23±0.10
0.20±0.10
0.20±0.10
0.10±0.10
0.10±0.10
0.20±0.10
0.20±0.10
0.50±0.05
0.40±0.05
0.3
0.5
L
W
TA
B
G
P
Average
Weight
(UNIT: mm)
•2 Array
•4 Array
•Reducing SMD surface area (40% reduced).
•Reducing SMD costs (75% reduced).
•Both flow and reflow soldering are applicable.
•Convex & concave type.
The product of lead-free terminal is RoHS compliant.
PhO(lead oxide) is included in the glass of our product which is prescribed
on RoHS appendix as an exception.
•For semiconductor devices.
•For computers, digital circuits.
Feature
Application
Structure and Dimensions
RF: Flat type array
RF
Code Designation
06: 0603
06
Dimension
2P: 2 Pieces
4P: 4 Pieces
4P
Resistors
J:
±5%
Jumper:
J
J
Tolerance
3 digit coding system
(IEC coding system)
E-24 series
R68
Resistance Value
CS : Tape Packaging 7"
ES : Tape Packaging 10"
AS : Tape Packaging 13"
CS
Packaging Code
•The part number system shall be in the following format
Parts Numbering System
<Top side>
<Bottom View>
L
G
P
L
PA
A
T
T
W
G
W
B
B



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