MP2249DN datasheet(2/12 Pages) MPS

2 / 12 page

MP2249 – 6V, 3A, 1MHZ, SYNCHRONOUS STEP-DOWN CONVERTER

MP2249 Rev.1.0

www.MonolithicPower.com

11/2/2010

MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.

RDERING INFORMATION

Part Number

Package

Top Marking

Free Air Temperature (TA)

MP2249DN

SOIC8E

MP2249

MP2249DQT *

TQFN10 (3mm x 3mm)

AAVY

-40°C to +85°C

* For Tape and Reel, add suffix -Z (e.g. MP2249DQT–Z).

For RoHS Compliant Packaging, add suffix - LF (e.g. MP2249DQT–LF–Z);

PACKAGE REFERENCE

TQFN10 (3mm x 3mm)

SOIC8E

ABSOLUTE MAXIMUM RATINGS (1)

PVIN to GND ...............................-0.3V to +6.5V

SW to GND ............................-0.3V to VIN +0.3V

FB, EN & PG to GND...................-0.3V to +6.5V

Junction Temperature.............................+150

°C

Continuous Power Dissipation (TA = +25°C)

(2)

SOIC8E...................................................... 2.5W

TQFN10 (3mmx3mm) ................................ 2.5W

Lead Temperature ..................................+260

°C

Storage Temperature .............. -65

°C to +150°C

Recommended Operating Conditions

(3)

Supply Voltage VIN .............................2.5V to 6V

Output Voltage VOUT...........................0.6V to 6V

Operating Junct. Temp. ........... -40

°C to +125°C

Thermal Resistance

(4)

θJA

θJC

SOIC8E .................................. 50 ...... 10...

°C/W

TQFN10 (3mmx3mm)............. 50 ...... 12...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature. TJ(MAX) the junction-to-

ambient thermal resistance θJA and the ambient temperature

TA. The maximum allowable power dissipation at any ambient

temperature is calculated using: PD(MAX)=(TJ(MAX)-TA)/ θJA.

Exceeding the maximum allowable power dissipation will

cause excessive die temperature, and the regulator will go

into thermal shutdown. Internal thermal shutdown circuitry

protects the device from permanent damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.

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