MP3356 datasheet(2/10 Pages) MPS

2 / 10 page

MP3356 – HIGH VOLTAGE PHOTO FLASH CHARGER AND IGBT DRIVER FOR DSC

MP3356 Rev. 0.91

www.MonolithicPower.com

1/29/2010

MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number*

Package

Top Marking

Free Air Temperature (TA)

MP3356DG

10-pin, 2x2 Flip QFN

4PY

–40

°C to +85°C

* For Tape & Reel, add suffix –Z (e.g. MP3356DG–Z).

For RoHS Compliant Packaging, add suffix –LF (e.g. MP3356DG–LF–Z)

PACKAGE REFERENCE

TOP VIEW

IGBTIN

IGBTOUT

VIN

AGND

PGND

VIN

ABSOLUTE MAXIMUM RATINGS

(1)

VIN to AGND.......................................-0.3Vto 6V

EN, IGBTIN, IGBTOUT, PG to AGND-0.3Vto 6V

FB to AGND...................................-60V to 350V

SW to AGND...................................-0.3V to 50V

PGND to AGND ……………………-0.3V to 0.3V

Storage Temperature............... -55

°C to +150°C

Continuous Power Dissipation (TA = +25°C)

(2)

…………………………………………..…....1.6W

Junction Temperature............................ +150

°C

Lead Temperature (Solder).....................+260

°C

Recommended Operating Conditions

(3)

Supply Voltage VIN .............................2.8V to 6V

Operating Junct. Temp (TJ)..... –40°C to +125°C

Thermal Resistance

(4)

θJA

θJC

2x2 Flip Chip ...........................80 ...... 16 ...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its operating

conditions.

4) Measured on JESD51-7, 4-layer PCB.

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