MP6212DN datasheet(2/11 Pages) MPS

2 / 11 page

MP6211/MP6212 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES

MP6211_MP6212 Rev. 1.1

www.MonolithicPower.com

9/18/2009

MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number

Enable

Switch

Maximum

Continuous

Load Current

Typical Short-

Circuit Current

@ TA=25C

Package

Top

Marking

Temperature

MP6211DN

Active

High

Single

1.0A

1.5A

SOIC8E

MP6211DH

Active

High

Single

1.0A

1.5A

MSOP8E

6211D

MP6212DN

Active

Low

Single

1.0A

1.5A

SOIC8E

MP6212DH

Active

Low

Single

1.0A

1.5A

MSOP8E

6212D

–40

°C to +85°C

* For Tape & Reel, add suffix –Z (eg. MP6211_MP6212DN–Z). For RoHS Compliant Packaging, add suffix –LF.

(eg. MP6211_MP6212DN–LF–Z)

PACKAGE REFERENCE

GND

EN*

OUT

FLAG

TOP VIEW

EXPOSED PAD

ON BACKSIDE

MP6211_MP6212

Single-Channel

(* EN is active high for MP6211)

ABSOLUTE MAXIMUM RATINGS

(1)

IN .................................................-0.3V to +6.0V

EN, FLAG, OUT to GND ..............-0.3V to +6.0V

Continuous Power Dissipation. (TA = +25°C)

(2)

SOIC8E...................................................... 2.5W

MSOP8E.................................................... 2.3W

Junction Temperature...............................150°C

Lead Temperature ....................................260°C

Storage Temperature...............–65°C to +150°C

Operating Temperature..............–40°C to +85°C

Thermal Resistance

(3)

θJA

θJC

SOIC8E .................................. 50 ...... 10...

°C/W

MSOP8E................................. 55 ...... 12...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) Measured on JESD51-7 4-layer PCB.

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