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STM32F215RG データシート(PDF) 124 Page - STMicroelectronics |
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STM32F215RG データシート(HTML) 124 Page - STMicroelectronics |
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124 / 175 page  Electrical characteristics STM32F21xxx 124/175 DocID17050 Rev 9 General PCB design guidelines Power supply decoupling should be performed as shown in Figure 51 or Figure 52, depending on whether VREF+ is connected to VDDA or not. The 10 nF capacitors should be ceramic (good quality). They should be placed them as close as possible to the chip. Figure 51. Power supply and reference decoupling (VREF+ not connected to VDDA) 1. VREF+ and VREF– inputs are both available on UFBGA176 package. VREF+ is also available on all packages except for LQFP64. When VREF+ and VREF– are not available, they are internally connected to VDDA and VSSA. Figure 52. Power supply and reference decoupling (VREF+ connected to VDDA) 1. VREF+ and VREF– inputs are both available on UFBGA176 package. VREF+ is also available on all packages except for LQFP64. When VREF+ and VREF– are not available, they are internally connected to VDDA and VSSA. V REF+ STM32F V DDA V SSA/V REF- 1 µF // 10 nF 1 µF // 10 nF ai17535 (See note 1) (See note 1) VREF+/VDDA STM32F 1 µF // 10 nF VREF–/VSSA ai17536 (See note 1) (See note 1) |
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