PixArt Imaging Inc.

PAS6337

CMOS Image Sensor IC

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PixArt Imaging Inc.

V1.0,

2012/05/24

Recommended Guideline for PCB Assembly

1.1 Recommended vender and type for Pb-free solder paste

1.

Almit LFM-48W TM-HP

2.

Senju M705-GRN360-K

1.2 IR Reflow Soldering Profile:

Temperature profile is the most important control in reflow soldering. It

must be fine tuned to establish a robust process.

The typical

recommended IR reflow profile is showed in figure 8 below.

IR Reflow Profile

Reflow Profile :

1.

Average Ramp-up Rate (30°C to preheat zone): 1.5~ 2.5 Degree C/

Sec

2.

Preheat zone:

2.1

Temp ramp from 170~ 200 degree C

2.2

Exposure time: 90 +/- 30 sec

3.

Melting zone:

3.1

Melting area temp > 220 degree C for at least 30 ~ 50 sec

3.2

Peak temperature : 245 degree C.

1.3 Others:

1.3.1 Epoxy under-filled process is required post IC mounting process.

☉ Dispense Epoxy

Epoxy

Epoxy Under-filled