PixArt Imaging Inc.

PAS6352

CMOS Image Sensor IC

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PixArt Imaging Inc.

V0.6,

2012/11/13

Recommended Guideline for PCB Assembly

Recommended vender and type for Pb-free solder paste

1.

Almit LFM-48W TM-HP

2.

Senju M705-GRN360-K

IR Reflow Soldering Profile:

Temperature profile is the most important control in reflow soldering. It must be fine tuned to establish

a robust process.

The typical recommended IR reflow profile is showed in figure below.

IR Reflow Profile

Reflow Profile :

1. Average Ramp-up Rate (30

°C to preheat zone): 1.5~ 2.5 Degree C/ Sec

2. Preheat zone:

2.1

Temp ramp from 170~ 200 degree C

2.2

Exposure time: 90 +/- 30 sec

3. Melting zone:

3.1

Melting area temp > 220 degree C for at least 30 ~ 50 sec

3.2

Peak temperature : 245 degree C.

Others:

Epoxy under-filled process is required post IC mounting process.

☉ Dispense Epoxy

Epoxy Under-filled

Epoxy