STBB2J30-R datasheet(21/25 Pages) STMICROELECTRONICS

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STBB2J30-R データシート(PDF) 21 Page - STMicroelectronics

部品番号	STBB2J30-R

部品情報	800 mA 2.5 MHz, high efficiency dual mode buck-boost DC-DC converter

PDF	25 Pages

Scroll/Zoom	100%

メーカー	STMICROELECTRONICS [STMicroelectronics]

ホームページ	http://www.st.com

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21 / 25 page

DocID022745 Rev 9

21/25

STBB2

Application information

Figure 22. Bottom layer

8.6

Thermal consideration

To enhance the thermal performance, the power dissipation capability of the PCB design

can be improved by traces as wider as possible. The maximum recommended junction

temperature (TJ) of the devices is 125 °C. The junction ambient thermal resistance of this

20-pin Flip Chip package is 80 °C/W, if all pins are soldered.

To the maximum ambient temperature TA = 85 °C the maximum power dissipated inside the

package is given by:

Equation 6

PDISS_MAX = (TJMAX - TAMAX) / RJA = (125 - 85) / 80 = 500 mW

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