LXXLD10

Preliminary

CMOS IC

UNISONICTECHNOLOGIESCO.,LTD

4 of 7

www.unisonic.com.tw

QW-R502-702.b



PARAMETER

SYMBOL

RATINGS

UNIT

-0.3 ~ +7

V

-0.3 ~ +3.3

V

EN and FB to GND

V

POK to GND

-0.3 ~ +7

V

Power Dissipation

3

W

Junction Temperature

150

°С

Storage Temperature

-65 ~ +150

°С

Note: Absolute maximum ratings are those values beyond which the device could be permanently damaged.

Absolute maximum ratings are stress ratings only and functional device operation is not implied.



THERMAL DATA

PARAMETER

SYMBOL

RATINGS

UNIT

Junction to Ambient (Note 1)

42

°C/W

Junction to Case (Note 2)

18

°C/W

The exposed pad of HSOP-8 is soldered directly on the PCB.

2. The Thermal Pad Temperature is measured on the PCB copper area connected to the thermal pad of

package.



OPERATING CONDITIONS

PARAMETER

SYMBOL

RATINGS

UNIT

Supply Voltage

Control

3.1 ~ 6

V

Supply Voltage

Input

1.1 ~ 3.3

V

Output Voltage

0.8 ~ 1.2

V

V

Output Current

0 ~ 1

A

Junction Temperature

-25 ~ +125

°С