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CS212 データシート(PDF) 7 Page - Cherry Semiconductor Corporation |
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CS212 データシート(HTML) 7 Page - Cherry Semiconductor Corporation |
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7 / 7 page ![]() 7 Thermal Data 16L 16L SO PDIP Wide RQJC typ 42 23 ûC/W RQJA typ 80 105 ûC/W Rev. 4/21/99 Package Specification PACKAGE DIMENSIONS IN mm (INCHES) D Lead Count Metric English Max Min Max Min 16L PDIP 19.69 18.67 .775 .735 16L SO Wide 10.50 10.10 .413 .398 PACKAGE THERMAL DATA Ordering Information Part Number Description CS212EN16 16L PDIP CS212EDW16 16L SO Wide CS212EDWR16 16L SO Wide Tape & Reel © 1999 Cherry Semiconductor Corporation Cherry Semiconductor Corporation reserves the right to make changes to the specifications without notice. Please contact Cherry Semiconductor Corporation for the latest available information. Plastic DIP (N); 300 mil wide 0.39 (.015) MIN. 2.54 (.100) BSC 1.77 (.070) 1.14 (.045) D Some 8 and 16 lead packages may have 1/2 lead at the end of the package. All specs are the same. .203 (.008) .356 (.014) REF: JEDEC MS-001 3.68 (.145) 2.92 (.115) 8.26 (.325) 7.62 (.300) 7.11 (.280) 6.10 (.240) .356 (.014) .558 (.022) Surface Mount Wide Body (DW); 300 mil wide 1.27 (.050) BSC 7.60 (.299) 7.40 (.291) 10.65 (.419) 10.00 (.394) D 0.32 (.013) 0.23 (.009) 1.27 (.050) 0.40 (.016) REF: JEDEC MS-013 2.49 (.098) 2.24 (.088) 0.51 (.020) 0.33 (.013) 2.65 (.104) 2.35 (.093) 0.30 (.012) 0.10 (.004) |
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