WSLS2512, Improved Stability

www.vishay.com

Vishay Dale

Revision: 05-Mar-14

2

Document Number: 30123

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

DIMENSIONS in inches (millimeters)

DERATING

Note

• Embossed Carrier Tape per EIA-481.

MODEL

DIMENSIONS

SOLDER PAD DIMENSIONS

L

W

H

T

a

b

l

WSLS2512

0.250 ± 0.010

(6.35 ± 0.254)

0.125 ± 0.010

(3.18 ± 0.254)

0.025 ± 0.010

(0.635 ± 0.254)

0.030 ± 0.010

(0.762 ± 0.254)

0.065

(1.65)

0.145

(3.68)

0.160

(4.06)

PERFORMANCE

TEST

CONDITIONS OF TEST

TEST LIMITS

0.25 %

0.5 %

Thermal shock

- 55 °C to + 150 °C, 1000 cycles, 15 min at each extreme

± (0.5 % + 0.005

) R

Short time overload

5 x rated power for 5 s for WSL2512 size or smaller

± (0.5 % + 0.005

) R

Low temperature operation

- 65 °C for 45 min

± (0.5 % + 0.005

) R

High temperature exposure

1000 h at + 170 °C

± (1.0 % + 0.005

) R

Bias humidity

+ 85 °C, 85 % RH, 10 % bias, 1000 h

± (0.5 % + 0.005

) R

Mechanical shock

100 g’s for 6 ms, 5 pulses

± (0.5 % + 0.005

) R

Vibration

Frequency varied 10 Hz to 2000 Hz in 1 min, 3 directions, 12 h

± (0.5 % + 0.005

) R

Load life

2000 h at 70 °C, 1.5 h “ON”, 0.5 h “OFF”

± 0.25 %

R

± 0.5 %

R

Resistance to solder heat

+ 260 °C solder, 10 s to 12 s dwell, 25 mm/s emergence

± (0.5 % + 0.005

) R

Moisture resistance

MIL-STD-202, method 106, 0 % power, 7b not required

± (0.5 % + 0.005

) R

L

T

W

H

l

b

a

Typical sensing traces

70

120

100

80

60

40

20

0

170

150

125

100

75

50

25

0

- 25

- 50

- 65

Ambient Temperature in °C

PACKAGING

MODEL

REEL

TAPE WIDTH

DIAMETER

PIECES/REEL

CODE

WSLS2512

12 mm/embossed plastic

178 mm/7"

2000

EA