ACT4533A/B

Rev 0, 14-Aug-13

Innovative Power

TM

- 17 -

www.active-semi.com

Copyright © 2013 Active-Semi, Inc.

PACKAGE OUTLINE

SOP-8EP PACKAGE OUTLINE AND DIMENSIONS

SYMBOL

DIMENSION IN

MILLIMETERS

DIMENSION IN

INCHES

MIN

MAX

MIN

MAX

A

1.350

1.700

0.053

0.067

A1

0.000

0.100

0.000

0.004

A2

1.350

1.550

0.053

0.061

b

0.330

0.510

0.013

0.020

c

0.170

0.250

0.007

0.010

D

4.700

5.100

0.185

0.200

D1

3.202

3.402

0.126

0.134

E

3.800

4.000

0.150

0.157

E1

5.800

6.200

0.228

0.244

E2

2.313

2.513

0.091

0.099

e

1.270 TYP

0.050 TYP

L

0.400

1.270

0.016

0.050

θ

0°

8°

0°

8°

Active-Semi, Inc. reserves the right to modify the circuitry or specifications without notice. Users should evaluate each

product to make sure that it is suitable for their applications. Active-Semi products are not intended or authorized for use

as critical components in life-support devices or systems. Active-Semi, Inc. does not assume any liability arising out of

the use of any product or circuit described in this datasheet, nor does it convey any patent license.

Active-Semi and its logo are trademarks of Active-Semi, Inc. For more information on this and other products, contact

is a registered trademark of Active-Semi.

Note:

1.

Lead Coplanarity is 0.1mm max.

2.

Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed

0.15mm per end.

3.

Dimension E does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25mm per side.