Thermal management

L6207Q

22/27

DocID018993 Rev 3

8

Thermal management

In most applications the power dissipation in the IC is the main factor that sets the maximum

current that can be delivered by the device in a safe operating condition. Therefore, it must

be considered very carefully. Besides the available space on the PCB, the right package

should be chosen considering the power dissipation. Heatsinking can be achieved using

copper on the PCB with proper area and thickness.

Table 8. Thermal data

Symbol

Parameter

Package

Typ.

Unit

Thermal resistance junction-ambient

1. VFQFPN48 mounted on EVAL6208Q rev 1 board (see EVAL6208Q databrief): four-layer FR4 PCB with

17

°C/W