http://www.optosupply.com

VER A.0

D

L

D

OSTBPCS2C2B

Precautions in Use for Surface Mount Diode

■ Storage

· Storage Conditions

Before opening the package:

The LEDs should be kept at 30°C or less and 60%RH or less. The LEDs should be used within a year. When storing

the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended.

· After opening the package:

Soldering should be done right after opening the package (within 24hrs).

Keeping of a fraction, sealing and Temperature: 5~40℃ Humidity: Less than 30%.

If the package has been opened more than 1 week or the color of desiccant changes, components should be dried for

10-12hrs, at 60±3℃.

· Optosupply LED electrode sections are comprised of a silver plated copper alloy. The silver surface may be

affected by environments which contain corrosive gases and so on. Please avoid conditions which may cause the

LED to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering operations.

It is recommended that the User use the LEDs as soon as possible.

· Please avoid rapid transitions in ambient temperature, especially in high humidity environments where

condensation can occur.

■ Soldering Heat Reliability (DIP):

IR Reflow soldering Profile

· Reflow soldering should not be done more than two times.

· When soldering, do not put stress on the LEDs during heating.

· After soldering, do not warp the circuit board.

· Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,

a double-head soldering iron should be used.

It should be confirmed beforehand whether the

characteristics of the LEDs will or will not be damaged by repairing.

Soldering

Average ramp-up rate = 3ºC/sec. max.

Preheat temperature: 130º~185ºC

Preheat time = 120 sec. max.

Ramp-down rate = 6ºC/sec. max.

Peak temperature = 230ºC max.

Time within 3ºC of actual

peak temperature = 25 sec. max.

Duration above 200ºC is 40 sec. max.

LED & Application Technologies