SSFN3313 datasheet(1/5 Pages) SILIKRON

部品番号	SSFN3313

部品情報	High Power and current handing capability

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SSFN3313

PACKAGE MARKING AND ORDERING INFORMATION

Device Marking

Device

Device Package

Reel Size

Tape width

Quantity

SSFN3313

DFN3x3-8L

-

ABSOLUTE MAXIMUM RATINGS(TA=25℃unless otherwise noted)

Parameter

Symbol

Limit

Unit

Drain-Source Voltage

VDS

-30

V

Gate-Source Voltage

VGS

±25

V

ID(25℃)

-8

A

ID(70℃)

-6

A

Drain Current-Continuous@ Current-Pulsed (Note 1)

IDM

-45

A

Maximum Power Dissipation

PD

3.1

W

Operating Junction and Storage Temperature Range

TJ,TSTG

-55 To 150

℃

THERMAL CHARACTERISTICS

Thermal Resistance,Junction-to-Ambient (Note 2)

RθJA

40

℃

/W

ELECTRICAL CHARACTERISTICS (TA=25℃unless otherwise noted)

Parameter

Symbol

Condition

Min

Typ

Max

Unit

OFF CHARACTERISTICS

Drain-Source Breakdown Voltage

BVDSS

VGS=0V ID=-250μA

-30

V

Zero Gate Voltage Drain Current

IDSS

VDS=-30V,VGS=0V

-1

μA

GENERAL FEATURES

●

VDS =-30V,ID =-8A

RDS(ON) < 25mΩ @ VGS=-4.5V

RDS(ON) < 14mΩ @ VGS=-10V

●

High Power and current handing capability

●

Lead free product is acquired

●

Surface Mount Package

DESCRIPTION

The SSFN3313 uses advanced trench

technology to provide excellent RDS(ON)

and low gate charge .This device is

suitable for use as a load switch or in

PWM applications.

Schematic diagram

D

G

S

Marking and pin Assignment

Application

●

PWM applications

●

Load switch

●

Power management

DFN3×3-8L BOTTOM VIEW

1

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