Pad Assignment

HT70XX (except HT7022A)

Chip size: 1317

´ 1158 (mm)

2

* The IC substrate should be connected to VDD in the

PCB layout artwork.

HT7022A only

Chip size: 2032

´ 1321 (mm)

2

* The IC substrate should be connected to VDD in the

PCB layout artwork.

Absolute Maximum Ratings

Supply Voltage, HT7022A only ....................................................................................................................

-0.3V to 13V

Output Current......................................................50mA

Storage Temperature ............................

-50°Cto125°C

Power Consumption ..........................................200mW

Operating Temperature ...............................0

°Cto70°C

Note: These are stress ratings only. Stresses exceeding the range specified under

²Absolute Maximum Ratings² may

cause substantial damage to the device. Functional operation of this device at other conditions beyond those

listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil-

ity.

HT70XX

Rev. 1.60

3

January 14, 2003

1

2

3

( 0 , 0 )

1

2

3

( 0 , 0 )

Pad Coordinates

HT70XX (except HT7022A)

Unit:

mm

Pad No.

X

Y

1

-483.30

-379.50

2

-234.60

-399.50

3

443.90

-386.00

HT7022A only

Unit:

mm

Pad No.

X

Y

1

-434.34

394.97

2

120.65

461.01

3

774.70

412.75