ICL232 datasheet(2/6 Pages) INTERSIL

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Absolute Maximum Ratings

Thermal Information

VCC to Ground .. .. ... .. .. .. .. .. .. .. .(GND -0.3V) < VCC <6V

V+ to Ground . . . . . ... .. .. .. .. .. .. .. . (VCC -0.3V) <V+<12V

V- to Ground .. .. .. ... .. .. .. .. .. .. .. -12V <V- < (GND +0.3V)

Input Voltages

T1IN,T2IN.. .. .. ... .. .. .. .. .. . (V- -0.3V) <VIN <(V+ +0.3V)

R1IN,R2IN . . . . . ... .. .. .. .. .. .. .. .. .. ... .. .. .. .. . ±30V

Output Voltages

T1OUT,T2OUT .. ... .. .. .. . (V- -0.3V) <VTXOUT <(V+ +0.3V)

R1OUT,R2OUT .. ... .. ..(GND -0.3V) <VRXOUT <(VCC +0.3V)

Short Circuit Duration

T1OUT,T2OUT .. ... .. .. .. .. .. .. .. .. .. ... .. .. Continuous

R1OUT,R2OUT .. ... .. .. .. .. .. .. .. .. .. ... .. .. Continuous

Operating Conditions

Temperature Ranges

ICL232C . .. .. .. ... .. .. .. .. .. .. .. .. .. ... .. ..0oCto 70oC

ICL232I . . . . . . . . ... .. .. .. .. .. .. .. .. .. ... .. -40oCto 85oC

ICL232M . .. .. .. ... .. .. .. .. .. .. .. .. .. ... .-55oCto 125oC

Thermal Resistance (Typical, Note 1)

θJA (oC/W) θJC (oC/W)

CERDIP Package . . . . . . ... .. .. .. .

PDIP Package . .. .. .. .. ... .. .. .. .

100

N/A

SOIC Package. .. .. .. .. ... .. .. .. .

100

N/A

Maximum Junction Temperature

Plastic Packages . .. .. .. ... .. .. .. .. .. .. .. .. .. ... .. 150oC

Ceramic Package .. .. .. ... .. .. .. .. .. .. .. .. .. ... .. 175oC

Maximum Storage Temperature Range .. .. .. .. .. -65oCto 150oC

Maximum Lead Temperature (Soldering 10s) .. .. .. .. ... .. 300oC

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation

of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTE:

θJA is measured with the component mounted on an evaluation PC board in free air.

Electrical Specifications

Test Conditions: VCC =+5V ±10%, TA = Operating Temperature Range. Test Circuit as in Figure 8

Unless Otherwise Specified

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNITS

Transmitter Output Voltage Swing, TOUT

T1OUT and T2OUT Loaded with 3kΩ

to Ground

±5

±9

±10

Power Supply Current, ICC

Outputs Unloaded, TA =25

oC-

TIN, Input Logic Low, VlL

0.8

TIN, Input Logic High, VlH

2.0

Logic Pullup Current, IP

T1IN,T2IN = 0V

200

µA

RS-232 Input Voltage Range, VIN

-30-

+30V

Receiver Input Impedance, RIN

VIN = ±3V

3.0

5.0

7.0

Ω

Receiver Input Low Threshold, VlN (H-L)

VCC =5V, TA =25

oC0.8

1.2

Receiver Input High Threshold, VIN (L-H)

VCC =5V, TA =25

oC-

1.7

2.4

Receiver Input Hysteresis, VHYST

0.2

0.5

1.0

TTL/CMOS Receiver Output Voltage Low, VOL

IOUT = 3.2mA

0.1

0.4

TTL/CMOS Receiver Output Voltage High, VOH IOUT = -1.0mA

3.5

4.6

Propagation Delay, tPD

RS-232 to TTL

0.5

µs

Instantaneous Slew Rate, SR

CL =10pF, RL =3kΩ,TA =25

(Notes 2, 3)

µs

Transition Region Slew Rate, SRT

RL =3kΩ,CL = 2500pF Measured

from +3V to -3V or -3V to +3V

-3

µs

Output Resistance, ROUT

VCC =V+= V- =0V, VOUT = ±2V

300

Ω

RS-232 Output Short Circuit Current, ISC

T1OUT or T2OUT Shorted to GND

±10

NOTES:

2. Guaranteed by design.

3. See Figure 4 for definition.

ICL232

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