13/19

XCL101

Series

<Top view>

<Bottom view>

■

NOTE ON USE (Continued)

●

Instruction of pattern layouts

2. Please mount each external component as close to the IC as possible.

3. Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit impedance.

4. Make sure that the ground traces are as thick as possible, as variations in ground potential caused by high ground currents at the time of

switching may result in instability of the IC.

5. Internal driver transistors bring on heat because of the transistor current and ON resistance of the driver transistors.

●

Recommended Pattern Layout