Thermal map

AN3089

16/25

DocID16493 Rev 2

4

Thermal map

In order to check the design reliability, a thermal mapping by means of an IR camera was

done. In Figure 16 and 17 the thermal measurements of the board, component side, at

nominal input voltage are shown. Some pointers visible in the images have been placed

across key components or components showing high temperature. The ambient

temperature during both measurements was 27 °C.

Figure 16. Thermal map at 115 Vac – 60 Hz – full load

Figure 17. Thermal map at 230 Vac – 50 Hz – full load

Table 2. Thermal map reference points

Point

Reference

Description

A

L1

EMI filtering common mode choke

B

D1

Bridge rectifier

C

D4

Clamping Transil

D

Q1

Flyback power MOSFET

E

R2

Input NTC

F

T1

Flyback power transformer

G

D2

Output diode