Application information

UM0422

12/14

Figure 8.

Bottom layer

7

Application information

7.1

Thermal information

The STCS1 is able to control an LED current up to 1.5 A and it is able to sustain a voltage

between drain pin and GND up to 40 V. Those operating conditions are however limited by

depends on the copper area and the number of layers of the printed circuit board under the

pad. DFN8 and PowerSO-8 have an exposed die attach pad which enhances the thermal

conductivity enabling high power application.

The power dissipation in the device can be calculated as:

Equation 3

Based on this and on the thermal resistance and ambient temperature, the junction

temperature can be calculated as:

Equation 4

Table 5.

Thermal data

Symbol

Parameter

MLP 3x3 8L

PowerSO-8

Unit

Thermal resistance junction-case

3

10

ºC/W

Thermal resistance junction-ambient

1.

This value is referred to four-layer PCB, JEDEC standard test board.

2.

With two sides, two planes PCB following EIA/JEDEC JESD51-7 standard.

P

D

V

DRAIN

V

FB

–

() I

LED

•

V

CC

I

CC

•

()

+

=

T

J

R

thJA

P

D

T

A

+

•

=