AN2639 datasheet(9/15 Pages) STMICROELECTRONICS

部品番号	AN2639

部品情報	Soldering recommendations and package information for Lead-free ECOPACK microcontrollers

PDF	15 Pages

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メーカー	STMICROELECTRONICS [STMicroelectronics]

ホームページ	http://www.st.com

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9 / 15 page

DocID14016 Rev 4

9/15

AN2639

Soldering

Refer to Figure 3 for the recommended reflow soldering profiles.

STMicroelectronics Lead-free packages are warranted for such reflow profile conditions.

Figure 3. Recommended reflow soldering profile

Table 3. JEDEC standard Lead-free reflow profile (according to J-STD-020D) (1)

1. All temperatures refer to topside of the package, measured on the body surface.

Profile feature

Lead-free assembly

Average ramp-up rate (Tsmax to TP)

3 °C/second max.

Preheat

-Temperature Min (Tsmin)

-Temperature Max (Tsmax)

-Time (tL)

150 °C

200 °C

60-120 seconds

Time maintained above:

-Temperature (TL)

-Time (tL)

217°C

60-150 seconds

Peak/classification temperature (TP)

Package dependant, see temperature indicated

on box label.

Time within 5 °C of actual peak temperature (TP) 30 seconds

Ramp-down rate

6°C/second max.

Time 25 °C to peak temperature

8 minutes max.

AN2639 データシート(PDF) 9 Page - STMicroelectronics