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AN2869 データシート(PDF) 13 Page - STMicroelectronics

部品番号 AN2869
部品情報  Guidelines for designing touch sensing applications
PDF  43 Pages
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メーカー  STMICROELECTRONICS [STMicroelectronics]
ホームページ  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

AN2869 データシート(HTML) 13 Page - STMicroelectronics

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AN2869
Main capacitive sensing guidelines
Doc ID 15298 Rev 6
13/43
2.2.4
Mechanical construction and PCB to panel bonding
In order to ensure stable touch detection, the PCB must always be at the same place on the
panel. The slightest variation, even as small as 100 microns, may lead to differences in the
signal which can be detected. This must be avoided to ensure the integrity of the touch
detection. The panel and other elements of the device must not be moved, or only as little as
possible, by the user’s finger. To avoid this kind of problem, glue, compression, co-convex
surfaces can be used to mechanically stabilize the PCB and the panel very close together.
In the list of the different ways to achieve this, we can put: heat staking plastic posts, screws,
ultrasonic welding, spring clips, non-conductive foam rubber pressing from behind, etc.
Figure 7.
Typical panel stack-up
Normal construction is to glue a sensor to a front panel with Pressure Sensitive Adhesive
(PSA). 3M467 or 468 PSAs work very well.
MS18974V1
Non-conductive panel
PCB
OR
Pressure-sensitive adhesive (PSA)
e.g. 3M467
Copper electrode



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