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LT1371 データシート(PDF) 11 Page - Linear Technology

部品番号 LT1371
部品情報  500kHz High Efficiency 3A Switching Regulator
PDF  16 Pages
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メーカー  LINER [Linear Technology]
ホームページ  http://www.linear.com
Logo LINER - Linear Technology

LT1371 データシート(HTML) 11 Page - Linear Technology

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LT1371
APPLICATIO S I FOR ATIO
maximum output load current and will also be increased if
poor quality (high ESR) output capacitors are used. The
addition of a 0.0047
µF capacitor on the VC pin reduces
switching frequency ripple to only a few millivolts. A low
value for RC will also reduce VC pin ripple, but loop phase
margin may be inadequate.
Layout Considerations
For maximum efficiency, LT1371 switch rise and fall times
are made as short as possible. To prevent radiation and
high frequency resonance problems, proper layout of the
components connected to the switch node is essential. B
field (magnetic) radiation is minimized by keeping output
diode, Switch pin and output bypass capacitor leads as
short as possible. Figures 3, 4 and 5 show recommended
positions for these components. E field radiation is kept
low by minimizing the length and area of all traces con-
nected to the Switch pin. A ground plane should always be
used under the switcher circuitry to prevent interplane
coupling.
The high speed switching current path is shown schemati-
cally in Figure 6. Minimum lead length in this path is
essential to ensure clean switching and low EMI. The path
including the switch, output diode and output capacitor is
the only one containing nanosecond rise and fall times.
Keep this path as short as possible.
VIN
S/S
GND
FB
VSW
VC
NFB
CONNECT
GROUND PIN
AND TAB DIRECTLY
TO GROUND PLANE
C
D
KEEP PATH FROM
VSW, OUTPUT DIODE,
OUTPUT CAPACITORS
AND GROUND RETURN
AS SHORT AS POSSIBLE
C
LT1371 • F03
Figure 3. Layout Considerations— R Package
VIN
S/S
GND
FB
VSW
VC
NFB
CONNECT
GROUND PIN
AND TAB DIRECTLY
TO GROUND PLANE.
TAB MAY BE
SOLDERED OR
BOLTED TO
GROUND PLANE*
C
D
KEEP PATH FROM
VSW, OUTPUT DIODE,
OUTPUT CAPACITORS
AND GROUND RETURN
AS SHORT AS POSSIBLE
*SEE T7 PACKAGE LAYOUT CONSIDERATIONS FOR VERTICAL MOUNTING
OF THE T7 PACKAGE
C
LT1371 • F04
Figure 4. Layout Considerations— T7 Package
Figure 6
LOAD
VOUT
L1
SWITCH
NODE
LT1371 • F06
VIN
HIGH
FREQUENCY
CIRCULATING
PATH
D
CONNECT ALL GROUND PINS TO GROUND PLANE
C
C
KEEP PATH FROM
VSW, OUTPUT DIODE,
OUTPUT CAPACITORS
AND GROUND RETURN
AS SHORT AS POSSIBLE
LT1371 • F05
VSW
NC
VSW
GND
GND
GND
GND
NC
NC
GND
VC
FB
NFB
GND
GND
GND
GND
SHDN
SYNC
VIN
Figure 5. Layout Considerations— SW Package



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