NJG1104KB2

- 12 -

nPACKAGE OUTLINE (FLP6-B2)

Lead material

: Copper

Lead surface finish : Solder plating

Molding material

: Epoxy resin

UNIT

: mm

Weight

: 6.5mg

Cautions on using this product

This product contains Gallium-Arsenide (GaAs) which is a harmful material.

• Do NOT eat or put into mouth.

• Do NOT dispose in fire or break up this product.

• Do NOT chemically make gas or powder with this product.

• To waste this product, please obey the relating law of your country.

This product may be damaged with electric static discharge (ESD) or spike voltage. Please handle

with care to avoid these damages.

[CAUTION]

The specifications on this databook are only

given for information , without any guarantee

as regards either mistakes or omissions. The

application circuits in this databook are

described only to show representative usages

of the product and not intended for the

guarantee or permission of any right including

the industrial rights.

2.0±0.1

6

5

4

1

2

3

0.65

0.65

0.75±0.05

+0.1

0.2- 0.05

+0.1

0.15- 0.05