LT8705_15 datasheet(2/44 Pages) LINER

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LT8705

8705fe

For more information www.linear.com/LT8705

pin conFiguraTion

absoluTe MaxiMuM raTings

VCSP-VCSN, VCSPIN-VCSNIN,

VCSPOUT-VCSNOUT...................................... –0.3V to 0.3V

SS, CLKOUT, CSP, CSN Voltage ................... –0.3V to 3V

VC Voltage (Note 2)................................... –0.3V to 2.2V

RT, LDO33, FBOUT Voltage.......................... –0.3V to 5V

IMON_IN, IMON_OUT Voltage ..................... –0.3V to 5V

SYNC Voltage............................................ –0.3V to 5.5V

INTVCC, GATEVCC Voltage............................ –0.3V to 7V

VBOOST1-VSW1, VBOOST2-VSW2 ..................... –0.3V to 7V

SWEN, MODE Voltage.................................. –0.3V to 7V

SRVO_FBIN, SRVO_FBOUT Voltage........... –0.3V to 30V

SRVO_IIN, SRVO_IOUT Voltage................. –0.3V to 30V

FBIN, SHDN Voltage................................... –0.3V to 30V

(Note 1)

CSNIN, CSPIN, CSPOUT, CSNOUT Voltage ..–0.3V to 80V

VIN, EXTVCC Voltage .................................. –0.3V to 80V

SW1, SW2 Voltage......................................81V (Note 7)

BOOST1, BOOST2 Voltage ......................... –0.3V to 87V

BG1, BG2, TG1, TG2........................................... (Note 6)

Operating Junction Temperature Range

LT8705E (Notes 3, 8)......................... –40°C to 125°C

LT8705I (Notes 3, 8).......................... –40°C to 125°C

LT8705H (Notes 3, 8)......................... –40°C to 150°C

LT8705MP (Notes 3, 8)...................... –55°C to 150°C

Storage Temperature Range .................. –65°C to 150°C

Lead Temperature (Soldering, 10 sec)

FE Package .......................................................300°C

13 14 15 16

TOP VIEW

GND

UHF PACKAGE

38-LEAD (5mm

× 7mm) PLASTIC QFN

17 18 19

38 37 36 35 34 33 32

SHDN

CSN

CSP

LDO33

FBIN

FBOUT

IMON_OUT

CLKOUT

SYNC

CSPOUT

CSNOUT

EXTVCC

SRVO_FBOUT

SRVO_IOUT

SRVO_IIN

SRVO_FBIN

BOOST1

TG1

SW1

TJMAX = 125°C, θJA = 34°C/W

EXPOSED PAD (PIN 39) IS GND, MUST BE SOLDERED TO PCB

TOP VIEW

FE PACKAGE

VARIATION: FE38(31)

38-LEAD PLASTIC TSSOP

GND

INTVCC

MODE

IMON_IN

SHDN

CSN

CSP

LDO33

FBIN

FBOUT

IMON_OUT

CLKOUT

SYNC

GND

BG1

GATEVCC

BG2

VIN

CSPIN

CSNIN

CSPOUT

CSNOUT

EXTVCC

BOOST1

TG1

SW1

SW2

TG2

BOOST2

TJMAX = 125°C, θJA = 25°C/W

EXPOSED PAD (PIN 39) IS GND, MUST BE SOLDERED TO PCB

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