RT9705B

11

DS9705B-03 April 2011

www.richtek.com

Layout Consideration

In order to meet the voltage drop, droop, and EMI requirements, careful PCB layout is necessary. The following guidelines

must be considered :

Keep all main current traces as short and wide as possible.

Place a ground plane under all circuitry to lower both resistance and inductance and improve DC and transient performance

(Use a separate ground and power plans if possible).

Locate the ceramic input capacitors as close as possible to the VIN and GND pins of the device.

Figure 1. Top Layer

Figure 2. Bottom Layer