BAS40_1PSXXSB4X_SER

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© NXP Semiconductors N.V. 2015. All rights reserved.

Product data sheet

Rev. 9 — 18 March 2015

12 of 22

NXP Semiconductors

BAS40 series; 1PSxxSB4x series

General-purpose Schottky diodes

11. Soldering

Dimensions in mm

Fig 15. Reflow soldering footprint SOD323 (SC-76)

Dimensions in mm

Fig 16. Wave soldering footprint SOD323 (SC-76)

Reflow soldering is the only recommended soldering method.

Dimensions in mm

Fig 17. Reflow soldering footprint SOD523 (SC-79)

msa433

1.65

0.50

(2

×)

2.10

1.60

2.80

0.60

3.05

0.50

0.95

solder lands

solder resist

occupied area

solder paste

msa415

1.40

4.40

5.00

1.20

2.75

preferred transport direction during soldering

solder lands

solder resist

occupied area

mgs343

1.80

1.90

0.30

0.40

0.50

1.20

0.60

2.15

solder lands

solder resist

occupied area

solder paste