CC3100_15 datasheet(13/44 Pages) TI

13 / 44 page

TX power level setting

19.00

17.00

15.00

13.00

11.00

9.00

7.00

5.00

3.00

1.00

54 OFDM

280.00

264.40

249.00

233.30

218.00

202.00

186.70

171.00

155.60

140.00

Color by

TX Power (dBm)

IBAT (VBAT @ 3.6 V)

CC3100

www.ti.com

SWAS031D – JUNE 2013 – REVISED FEBRUARY 2015

Figure 4-5. TX Power and IBAT vs TX Power Level Settings (54 OFDM)

4.10 Thermal Characteristics for RGC Package

AIR FLOW

PARAMETER

0 lfm (C/W)

150 lfm (C/W)

250 lfm (C/W)

500 lfm (C/W)

θja

14.6

12.4

10.8

Ψjt

0.2

0.3

0.1

Ψjb

2.3

2.2

2.4

θjc

6.3

θjb

2.4

4.11 Timing and Switching Characteristics

4.11.1 Power Supply Sequencing

For proper operation of the CC3100 device, perform the recommended power-up sequencing as follows:

1. Tie VBAT (pins 37, 39, 44) and VIO (pins 54 and 10) together on the board.

2. Hold the RESET pin low while the supplies are ramping up. TI recommends using a simple RC circuit (100K ||

0.1 µF, RC = 10 ms).

3. For an external RTC clock, ensure that the clock is stable before RESET is deasserted (high).

For timing diagrams, see Section 4.11.2, Reset Timing.

4.11.2 Reset Timing

4.11.2.1 nRESET (32K XTAL)

Figure 4-6 shows the reset timing diagram for the 32K XTAL first-time power-up and reset removal.

Specifications

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