LM7341MFSLASHNOPB datasheet(2/27 Pages) TI

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140

100k

100M

FREQUENCY (Hz)

-20

10M

10k

100

120

158

-23

113

135

GAIN

PHASE

RL = 1 M:

CL = 20 pF

±1.35V

±5V

±15V

±1.35V

±15V

±5V

140

100k

100M

FREQUENCY (Hz)

-20

10M

10k

100

120

158

-23

113

135

GAIN

PHASE

VS = ±15V

RL = 1 M:

CL = 20 pF

-40°C

25°C

125°C

125°C, 25°C, -40°C

LM7341

SNOSAW9B – MAY 2008 – REVISED MARCH 2013

www.ti.com

Typical Performance Characteristics

Figure 1. Open Loop Frequency Response

Figure 2. Open Loop Frequency Response

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

ESD Tolerance(3)

Human Body Model

2000V

Machine Model

200V

Charge-Device Model

1000V

VIN Differential

±15V

Voltage at Input/Output Pin

(V+) + 0.3V, (V−)

−0.3V

Supply Voltage (VS = V

+ − V−)

35V

Input Current

±10 mA

Output Current(4)

±20 mA

Power Supply Current

25 mA

Soldering Information

Infrared or Convection (20 sec)

235°C

Wave Soldering Lead Temp. (10 sec.)

260°C

Storage Temperature Range

−65°C to 150°C

Junction Temperature(5)

150°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(3)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of

JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).

(4)

Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in

exceeding the maximum allowed junction temperature of 150°C.

(5)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) − TA)/θJA. All numbers apply for packages soldered directly unto a PC board.

Operating Ratings

(1)

Supply Voltage (VS = V

+ − V−)

2.5V to 32V

Temperature Range(2)

−40°C to 125°C

Package Thermal Resistance (

θJA)

5-Pin SOT-23

325°C/W

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics.

(2)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) − TA)/θJA. All numbers apply for packages soldered directly unto a PC board.

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