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LP38853 データシート(PDF) 5 Page - Texas Instruments

部品番号 LP38853
部品情報  LP38853 3A Fast-Response High-Accuracy Adjustable LDO Linear Regulator with Enable and Soft-Start
PDF  28 Pages
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メーカー  TI [Texas Instruments]
ホームページ  http://www.ti.com
Logo TI - Texas Instruments

LP38853 データシート(HTML) 5 Page - Texas Instruments

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LP38853
www.ti.com
SNVS335D – DECEMBER 2006 – REVISED APRIL 2013
Electrical Characteristics (continued)
Unless otherwise specified: VOUT = 0.80V, VIN = VOUT(NOM) + 1V, VBIAS = 3.0V, VEN = VBIAS, IOUT = 10 mA, CIN = COUT = 10 µF,
CBIAS = 1 µF, CSS = open. Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction
temperature (TJ) range of -40°C to +125°C. Minimum and Maximum limits are specified through test, design, or statistical
correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes
only.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
AC Parameters
VIN = VOUT(NOM) + 1V,
-
80
-
f = 120 Hz
PSRR
Ripple Rejection for VIN Input
(VIN)
Voltage
VIN = VOUT(NOM) + 1V,
-
70
-
f = 1 kHz
dB
VBIAS = VOUT(NOM) + 3V,
-
58
-
f = 120 Hz
PSRR
Ripple Rejection for VBIAS Voltage
(VBIAS)
VBIAS = VOUT(NOM) + 3V,
-
58
-
f = 1 kHz
Output Noise Density
f = 120 Hz
-
1
-
µV/
√Hz
en
BW = 10 Hz
− 100 kHz
-
150
-
Output Noise Voltage
µVRMS
BW = 300 Hz
− 300 kHz
-
90
-
Thermal Parameters
Thermal Shutdown Junction
TSD
-
160
-
Temperature
°C
TSD(HYS)
Thermal Shutdown Hysteresis
-
10
-
PFM
-
60
-
Thermal Resistance, Junction to
θJ-A
DDPAK-7
-
60
-
Ambient(5)
SO PowerPAD-8
-
168
-
°C/W
PFM-7
-
3
-
Thermal Resistance, Junction to
θJ-C
DDPAK-7
-
3
-
Case(5) (6)
SO PowerPAD-8
-
11
-
(5)
Device power dissipation must be de-rated based on device power dissipation (PD), ambient temperature (TA), and package junction to
ambient thermal resistance (
θJA). Additional heat-sinking may be required to ensure that the device junction temperature (TJ) does not
exceed the maximum operating rating. See the Application Information section for details.
(6)
For PFM and DDPAK:
θJ-C refers to the BOTTOM surface of the package, under the epoxy body, as the 'CASE'. For SO PowerPAD-8:
θJ-C refers to the DAP (aka: Exposed Pad) on BOTTOM surface of the package as the 'CASE'.
Copyright © 2006–2013, Texas Instruments Incorporated
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