MM196 datasheet(1/1 Pages) MICROSEMI

部品番号	MM196

部品情報	6 MOSFET Multi-Chip Module

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メーカー	MICROSEMI [Microsemi Corporation]

ホームページ	http://www.microsemi.com

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1 / 1 page

Microsemi

Santa Ana Division

2830 S. Fairview Street, CA. 92704, 714-979-8220, Fax: 714-557-5989

Page 1

Copyright

 2000

MSC1589.PDF ,2000-09-20

MM196

6 MOSFET Multi-Chip Module

PRELIMINARY SPECIFICATION

SAN T A ANA DIV I S I ON

DESCRIPTION

The MM196 is a Multi-Chip Module, MCM, incorporating 6 independent

MOSFET die into a convenient BGA package. This device is also available

as discrete individual packaged Powermite3, see Microsemi data sheet

UPF1N100. This device is also available as bare die, see Microsemi data

sheet MSAFA1N100D. The MM196 allows users to externally connect the

MOSFETs via a motherboard or next assembly substrate into any

configuration desired. Custom variations of this product incorporating other

Microsemi protection die and/or passive components are available by

contacting the factory.

IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com

INDIVIDUAL COM P ONENT

INDIVIDUAL COM P ONENT SP ECIFI CAT IONS

SP ECIFI CAT IONS

Components

Manufacturer

Part Number

Q1 – Q6

Microsemi Santa Ana

MSAFA1N100D

Characteristics

Note: Refer to individual data sheets for component performance.

If there are conflicting requirements, this document takes precedence.

Ma xi mu m Ra tin g s @ 25 ºC

( U N L ES S O T H E R W IS E SP EC I F I E D )

Parameter

S y m b o l

Min

Max

Unit

Peak Repetitive Drain

to Source Voltage

VDSS

1000

V

Operating Temperature

Range

Top

10

55

º C

Ma xi mu m Ra tin g s @ 25 ºC

( U N L ES S O T H E R W IS E SP EC I F I E D )

Description

C o n d it ion s

TYP

Max

Unit

Drain-Source On-State

Resistance, RDS(ON)1

VGS = 10 Vdc,

ID= 1 mAdc

12.5

13.5

ohm

Drain-Source On-State

Resistance, RDS(ON)2

VGS= 7 Vdc,

ID= 5…150

mAdc

TC= 37º C

12.5

ohm

KEY FEATURE S

!"Miniature size, Multi-Chip

Module, MCM

!"Convenient mounting, Ball Grid

Array, BGA

!"Sn63/Pb37 solder bumps

(Alternate attach methods

available)

!"Maximum switch voltage 1000V

APPLICATIONS/BENEFIT

APPLICATIONS/BENEFITS

SS

S

!"Three phase switching

!"AC-DC converters

!"Applications utilizing multiple

MOSFET die in multiple or array

configurations

Schematic

Configuration and Dimensions

Top View

0.38” typical

Microsemi

MM196

0.35”

typical

0.050”

max

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