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ASM330LXH データシート(PDF) 53 Page - STMicroelectronics |
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ASM330LXH データシート(HTML) 53 Page - STMicroelectronics |
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53 / 56 page ![]() DocID027411 Rev 3 53/56 ASM330LXH Soldering information 56 7 Soldering information The LGA package is compliant with the ECOPACK®, RoHS and "Green" standard. It is qualified for soldering heat resistance according to JEDEC J-STD-020. Leave "Pin 1 Indicator" unconnected during soldering. Land pattern and soldering recommendations are available at www.st.com/mems. |
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